Specifications:

• Board Type: Solderless Breadboard
• Dimensions: 172mm x 39mm x 10mm
• Tie Points: 640 tie points
• Connection Layout:
  5 rows of 64 tie points (3x rail-style power and ground)
  Each row is electrically connected, enabling easy connections between components
• Material: High-quality ABS plastic with metal clips for secure connections
• Maximum Current Rating: ~1A per row
• Operating Temperature: 0°C to +70°C
• Applications: Prototyping electronic circuits, testing components, and educational use for electronics projects.